Numerical simulation for the problem of dynamics of oxide film growth in semiconductor substrates on the basis of geometrical approach and the Deal-Grove method

Authors

  • A.L. Alexandrov S.A. Khristianovich Institute of Theoretical and Applied Mechanics of SB RAS
  • G.A. Tarnavsky S.A. Khristianovich Institute of Theoretical and Applied Mechanics of SB RAS
  • S.I. Shpak S.A. Khristianovich Institute of Theoretical and Applied Mechanics of SB RAS
  • A.I. Gulidov S.A. Khristianovich Institute of Theoretical and Applied Mechanics of SB RAS
  • M.S. Obrecht Siborg Systems Inc.

Keywords:

численные методы, краевые задачи, сегрегационные эффекты, диффузия, процессы окисления, математическое моделирование, параллельные вычисления

Abstract

An approximate simulation for the dynamics of oxide film growth in semiconductor substrates is developed. A generalization of the 1D Deal-Grove method to 2D problems is proposed on the basis of geometrical approach. Some numerical results are given for the following cases: 1) the growth of a subregion for SiO2 under oxidation in various mediums (O2 or H2O) and 2) the dynamics of oxide/material and oxide/oxidant boundaries in a wide range of constitutive parameters and nitride masks covering a part of the silicon surface.

Author Biographies

A.L. Alexandrov

G.A. Tarnavsky

S.I. Shpak

A.I. Gulidov

M.S. Obrecht

References

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  7. Тарнавский Г.А., Шпак С.И., Обрехт М.С. Численное моделирование и компьютерный алгоритм процесса сегрегации легирующих примесей на границе волны окисления в полупроводниковых подложках // Вычислительные методы и программирование. 2001. 2, № 1. 16-30 (электронный адрес журнала: http://num-meth.srcc.msu.su).

Published

27-06-2001

How to Cite

Александров А., Тарнавский Г., Шпак С., Гулидов А., Обрехт М. Numerical Simulation for the Problem of Dynamics of Oxide Film Growth in Semiconductor Substrates on the Basis of Geometrical Approach and the Deal-Grove Method // Numerical Methods and Programming (Vychislitel’nye Metody i Programmirovanie). 2001. 2. 92-111

Issue

Section

Section 1. Numerical methods and applications

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